While traditional SEM instruments are inherently limited by small, uncalibrated fields of view (FOVs) and imprecise sample positioning, the CHIPSCANNER addresses these challenges by combining the resolution and flexibility of an SEM instrument with the accuracy, stability, and automation of an electron beam lithography (EBL) instrument – a core area of expertise at Raith.
connectomics) require surfaces of up to cm² areas to be scanned with nm resolution and excellent layer to layer accuracy (‘3D stitching’) for layout and schematic extraction or 3D modeling. Large-area, ultra-high-resolution 3D SEM imaging applications in chip reverse engineering, materials science, and life sciences (e.g.
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